Awards

February

Awarded the ASM Assembly Systems awarded the 2020 New Product Introduction (NPI) Award for Component Placement – Accessory Technologies: Siplace SmartFeeder AutoRefill.
Awarded by Circuits Assembly and Printed Circuit Design and FAB

Awarded the ASM Assembly Systems awarded the 2020 Innovation Awards for ASM DEK TQ (Category: Assembly Equipment)
Awarded by IPC

Recognised ASM Technology Singapore (ATS) as a valued partner in Learning Enterprise Alliance (LEA) 2020.
Awarded by Institute for Adult Learning Singapore

January

Recognized ASM Technology Singapore (ATS) for supporting the Professional Conversion Programme (PCP) in the electronic industry.
Awarded by the Singapore Semiconductor Industry Association (SSIA), with support from Workforce Singapore.

December

“Company of the Year 2019” in the SMT category
Awarded by CIO Review India Magazine

Hong Kong Corporate Citizenship Award Scheme (Enterprise Category): Merit Award
Awarded by Hong Kong Productivity Council – HKET

"Best Innovative Recruitment Campaign Award": Platinum Award
"Best Office Facilities Award": Platinum Award
Awarded by CTgoodjobs’ Best HR Awards 2019.

Hong Kong Outstanding Enterprises Parade 2019
Also awarded in 2017.

2019 Junzi Corporate Award
Awarded by the Hang Seng University of Hong Kong (‘HSUHK’)
James Chow (Right), EVP for Business Excellence, receiving the 2019 Junzi Corporate Award on behalf of CEO, Lee Wai Kwong.

November

"Industrialist Of The Year" Award 2019
Awarded by Federation of Hong Kong Industries (FHKI)

ASM Amicra awarded the Productronica Innovation Award 2019 in the Semiconductor Cluster for CoS Die-Bonder
Awarded by productronica in collaboration with "productronic” magazine at productronica 2019.

October

Singapore Quality Award 2019
Awarded by Enterprise Singapore

ASM Technology Singapore (ATS) was honored with the Best Practices Award at the EENP Awards 2019.
Awarded by Energy Efficiency National Partnership (EENP) – A National Environment Agency (NEA) programme.

September

Awarded by Asiamoney

ASM Assembly Systems awarded the “Manufacturing Excellence in Printing Solutions” (Printing Solutions Divisions (DEK)) and “Smart SMT Factory Award” (Placement Solutions Divisions (SIPLACE)).
Awarded by Electronics Maker Magazine at productronica India 2019 exhibition.

ASM Assembly Systems's India Sales office awarded the “Excellence in Customer Service Award”
By Incap Contract Manufacturing Services Pvt. Ltd.

August

Forbes Asia “Best Over A Billion”
Awarded by Forbes Asia

July

HKMA Quality Award Grand Award 2019
Awarded by Hong Kong Management Association

June

, "10 BEST Chip Making Suppliers" and "The BEST Assembly and Test Suppliers" from VLSI Customers Satisfaction Survey 2019
Recieved triple win for a third year. Also awarded in 2018 and 2017.

Recognized as the Top 100 Global Technology Leaders
Awarded by Thomson Reuters

Awarded 2018 Factory of the Year/Global Excellence in Operations (GEO) Award in the Excellent Production Network category.
Honoring Munich (Germany), Weymouth (UK), Singapore and Malaysia ASM Assembly System factories.
Awarded by Produktion magazine and AT Kearney.
Also awarded in 2012 and 2016.

ASM Pacific Technology awarded Singapore Quality Class 2018
Awarded by Enterprise Singapore

, "10 BEST Chip Making Suppliers" and "The BEST Assembly and Test Suppliers" from VLSI Customers Satisfaction Survey 2018
Triple win for a second year. Also awarded in 2017.

ASM Pacific Technology celebrates Third Time Win in Technological Achievement Grand Award 2017
Awarded by the Hong Kong Awards for Industries (HKIA)
Also awarded in 1999 and 2015

ASM ?Pacific Technology won "The Directors of the Year Awards 2017"
Awarded by The Hong Kong Institute of Directors (HKIoD) and co-organized by The Financial Services and the Treasury Bureau; Securities and Futures Commission and the Hong Kong Exchanges and Clearing Limited

ASM Pacific Technology named
Awarded by the Economic Digest

Honored?with 3 awards - Ranked 1st in Assembly, 10 BEST Chip Making?Suppliers and The?BEST Assembly and Test Suppliers from VLSI Customers Satisfaction Survey 2017

Awarded one of the “Best Investor Relations Company” and Asia's Best CEO (Investor Relations)
Awarded?by Corporate Governance Asia

Ranked Among the 10 BEST Large Semiconductor Equipment Suppliers in the VLSI Customer Satisfaction Survey 2017

Received 25 Years Supplier Partnership Award
From Unisem Group

Received Best Partner Supplier Award
From Tongfu Microelectronics Co. Ltd.

Awarded the 2016 New Product Introduction (NPI) Awards for Automation Tools: Siplace Bulkfeeder X
Awarded by Circuits Assembly

ASM Assembly System's Munich factory was awarded Factory of the Year 2016 Award
Awarded by Produktion/AT Kearney

Ranked among the top 10 Hong Kong companies in two categories: “Best Managed Companies” and “Best at Investor Relations”
Awarded by FinanceAsia

Ranked among the Top 5 in the VLSI Customer Satisfaction Survey 2016

Ranked 3rd in the category of Assembly Equipment and 4th in Test Equipment in the VLSI Customer Satisfaction Survey 2016

2016 Corporate Governance Asia – Best Investor Relations Company

Received 2015 Supplier Excellence Award (SEA)
Awarded by Texas Instruments (TI)

Received the Best FOL Equipment Supplier and Best Quality Supplier awards
Awarded by Hana Semiconductor (Ayutthaya)

Received the 2015 Best Supplier award
Awarded by ASE Group

Awarded the 2015 Technological Achievement Grand Award for Thermo-Compression Bonding (TCB) tool.
Awarded by the Hong Kong Awards for Industries (HKAI)

Ranked as the “Top Supplier” by the VLSIresearch

Awarded the "Best Small Cap - Hong Kong" in FinanceAsia's “Asia's Best Companies Poll 2014

SMT Solutions Business honored with the German "Global Excellence in Operations" Award
Awarded by Produktion magazine and AT Kearney

ATS received the “International Headquarters Award”
Awarded by the Singapore Economic Development Board

Advanced Packaging Award: Die Equipment and Materials category (MCM12)
Awarded by Advanced Packaging

Advanced Packaging Award: Dispensing / Encapsulation / Molding / Underfill Equipment & Materials category (IDEALcompress?)
Awarded by Advanced Packaging

Named the “2007 Overall Best Managed Company” in Hong Kong in the mid-cap category
Awarded by AsiaMoney

Ranked 8th in the “Best Managed Company” in Hong Kong
Awarded by FinanceAsia

Ranked top 3 in the “Best Mid-Cap” category
Awarded by FinanceAsia

Ranked top 10 for Best Investor Relations and top 5 for Most Committed to a Strong Dividend Policy

Awarded the “Editor’s Choice Best Product” Award (Osprey)
Awarded by Semiconductor International

Advanced Packaging Award: Dispensing/Encapsulation/Molding/Underfill Equipment & Materials category (Osprey)
Awarded by Advanced Packaging

Advanced Packaging Award: Wire Bonding Equipment category (Harrier)
Awarded by Advanced Packaging

Advanced Packaging Award: Substrate & Submount Equipment & Materials category (BP2000)
Awarded by Advanced Packaging

Awarded the “Editor's Choice Best Product” Award (IDEALmold?)
Awarded by Semiconductor International

Advanced Packaging Award: Encapsulation/Molding category (IDEALmold?)
Awarded by Advanced Packaging

Advanced Packaging Award: Die Attach Equipment and Material category (AD898CC Automatic Die Donder with clean cell system / GA898CC Automatic Glass Bonder)
Awarded by Advanced Packaging

Voted one of the Asia’s “Top Ten Best Managed Company in Hong Kong”
In a survey by FinanceAsia

Ranked “Top 10 Best Suppliers”
Awarded by the VLSIresearch

Advanced Packaging Award: Encapsulation/Molding category (IDEALmold? R2R)
Awarded by Advanced Packaging

Advanced Packaging Award: Wire Bonding category (Eagle60 Wire Bonder)
Awarded by Advanced Packaging

Advanced Packaging Award: Handling Equipment/Handling category (NRTH Test Handler)
Awarded by Advanced Packaging

Ranked “Top 10 Best Suppliers” by VLSIresearch

Advanced Packaging Award: Encapsulation/Molding category (IDEALmold? Application for Pinnacle Gating System and Soft Technology)
Awarded by Advanced Packaging